Editor-in-Chief

• Mohammed Omar  Clemson University, United States of America

Associate Editors

• Adel Mohamed  University of Quebec at Chicoutimi, Canada
• Sudesna Roy  Boston University, United States of America
• Vijay Kumar Srivastava  Indian Institute of Technology, India

Editorial Assistant

• John Martin  Canadian Center of Science and Education, Canada

Reviewers

• Aiping Zeng  University of Hawaii at Manoa, United States of America
• Alex Neves Junior  Federal University of Mato Grosso, Brazil
• Alireza Saeed-Akbari  SCHMOLZ+BICKENBACH AG, Switzerland
• Amir Dehghanghadikolaei  Oregon State University, United States of America
• Anil Desireddy  Center for Integrated Nanotechnologies (CINT), United States of America
• Anshuman Mangalum  Rutgers University, United States of America
• Ariful Haque  North Carolina State University, United States of America
• B R Chandan  G Madegowda Institute of Technology, India
• Binod Dhakal  The University of Akron, United States of America
• Biplab K Roy  3M Company, United States of America
• Blanca Teresa Perez-Maceda  Staff Scientist Cell-Biomaterial Recognition Lab. CIB-CSIC., Spain
• Bo Peng  University of Washington, United States of America
• Carlos Henrique Gomes Martins  University of Franca, Brazil
• Cherukupalli Rajesh  K. L. University, India
• Chiajen Hsu  University of Texas at Arlington, United States of America
• Chinwuba Ned Arum  The Federal University of Technology, Akure, Nigeria
• Chong Teng  ANSYS - MBU Additive Manufacturing, United States of America
• Chun Yang  University of California, United States of America
• Dimitris Karamichos  Harvard Medical School, United States of America
• Emre Erdem  University of Freiburg, Germany
• Enrico A Franceschi  University of Genoa, Italy
• Era Jain  Saint Louis University, United States of America
• Fan Lifeng  Inner Mongolia University of Technology, China
• Florian Puch  RWTH Aachen University, Germany
• Garima Thakur  University of Washington, United States of America
• Geetha Priyadarshini Badhirappan  Indian Institute of Technology Delhi, India
• Gholam Ali Koohmareh  University of Isfahan, Iran
• Hadi Haeri  Sharif university of technology, Iran
• Hieu Pham Trung Nguyen  New Jersey Institute of Technology, United States of America
• Hiresh Moradi  Amirkabir University of Technology, Iran
• Honggang Zhou  Center for Reliable Energy Systems, United States of America
• Huan Zhou  Changzhou University, China
• Ibrahim Qazi  Institute of Space Technology, Pakistan
• Ioannis Rabias  NCSR DEMOKRITOS, Greece
• Jan Setiawan  National Nuclear Energy Agency (BATAN), Indonesia
• Jianguo Zhou  Wright Materials Research Co. 1187 Richfield Center, United States of America
• Jianyin Chen  National Research Council of Canada, Canada
• Jianzhong Ma  Shaanxi University of Science and Technology, China
• Jin-Hyuk Bae  Kyungpook National University, Republic of Korea
• Jing Cheng  University of Rochester, United States of America
• Jing Li  University of Tennessee at Knoxville, United States of America
• Jingwei Zhao  University of Wollongong, Australia
• Joice Sophia Ponraj  University of Information Science and Technology, Republic of Macedonia
• Juan José Villaverde  INIA - National Institute for Agricultural and Food Research and Technology, Spain
• Jun Wang  The State University of New Jersey, United States of America
• Kai Yan  Brown University, United States of America
• Kin Mun Wong  Ilmenau University of Technology (Technische Universität Ilmenau), Germany
• Kuldeep Wadhwa  SABIC, Netherlands
• Kun Cheng  University of California at Berkeley, United States of America
• Kwek-Tze Tan  The University of Akron, United States of America
• Leming Sun  The Ohio State University, United States of America
• Linyun Liang  Argonne National Laboratory, United States of America
• Mahamad Ahamad Mohiddon  University of Trento, Italy
• Mahla Zabet  Mississippi State University, United States of America
• Malay Milan Samantaray  Maxim Integrated Products, INC., United States of America
• Mamdouh El-Bakry  Cairo University, Egypt
• Manik Pavan Kumar Maheswaram  AMERICHEM. INC, United States of America
• Md. Mehedi Hasan  Universiti Kebangsaan Malaysia, Malaysia
• Mohammad Dinari  Isfahan University of Technology, Iran
• Mohan Prasad Manoharan  Intel Corporation, United States of America
• Mohd Mustafa Al Bakri Abdullah  Universiti Malaysia Perlis (UniMAP), Malaysia
• Mohsen Purahmad  SanDisk Corporation, United States of America
• Mosaad Mohamad Sadawy  Faculty of Engineering, Al-Azhar University, Egypt
• Mostafa Ragab Abd El Wahab  Beni Suef University, Egypt
• Nadir Ayrilmis  Istanbul University, Turkey
• Niranjan Patra  University of Wyoming, USA, United States of America
• Nouari Saheb  King Fahd University of Petroleum and Minerals, Saudi Arabia
• Özge ERDEM  Bayburt University, Turkey
• Pan Gong  Huazhong University of Science and Technology, China
• Paulo Nobre Balbis Reis  University of Beira Interior, Portugal
• Pawel NOWAKOWSKI  Fischione Instruments Inc., United States of America
• Peng Si  Stanford University, United States of America
• Prachee Chaturvedi  University of Florida
• Qibing Chang  Jingdezhen Ceramic Institute, China
• Qun Ye  Institute of Materials Reseach and Engineering, Singapore
• Raja Rizwan Hussain  King Saud University, Saudi Arabia
• Raveesh Shenoy  3M Company, United States of America
• Reza Bihamta  Alcoa innovation, Canada
• Rosa María Lozano  Centro de Investigaciones Biológicas (CIB-CSIC), Spain
• Roya Damircheli  Amirkabir University of Technology, Iran
• Rui Liu  Kent State University, United States of America
• Salvatore Russo  Iuav University of Venice,Italy, Italy
• Santanu Das  University of North Texas, United States of America
• Shan Jiang  University of Missouri, United States of America
• Shanhong Xu  National Institute of Standards and Technology, United States of America
• Shriram Madapusi  Corning Inc., United States of America
• Shudipto Konika Dishari  University of Nebraska, Lincoln, United States of America
• Sneha Krishna Murthy  The University of Tampa, United States of America
• Swati Mishra  Oregon Health and Science University, United States of America
• Talib Mohammed Naieff  Baghdad-Iraq-University of Technology, Iraq
• Tathagata Mukherjee  Seagate Technology, United States of America
• Tongan Jin  Pacific Northwest National Laboratory, United States of America
• Tushar M. Shimpi  Colorado State University, United States of America
• Ujwal S Patil  University of New Orleans, United States of America
• Vamsi K Devarapalli  IBM, United States of America
• Vanga Rajendar  Jawaharlal Nehru Technological University of Hyderabad, India
• Victor M. Ovando-Medina  Universidad Autónoma de San Luis Potosí, Mexico
• Vijay Kumar Sharma  Bilkent University, Turkey
• Vikas S Padalkar  Osaka University, Japan
• Vishwas N Bedekar  Middle Tennessee State University, United States of America
• Viswas Purohit  Alliance University, United States of America
• Wei Deng  Alfred University, United States of America
• Wei Zhang  Boston University, United States of America
• Weiwei Jian  North Carolina State University, United States of America
• Wenmei Ming  University of Utah, United States of America
• Xiaodong Ma  The University of Queensland, Australia
• Xiaojun Zhang  Lawrence Berkeley National Laboratory, United States of America
• Xing Zhao  University of South Carolina, United States of America
• Xuechun Shen  Shanghai Feilihua Shichuang Technology, Shanghai, China, China
• Yan Huo  Michigan Technological University, United States of America
• Yang Lu  National Institute of Standards and Technology (NIST), United States of America
• Yashraj Gartia  Bayer Health Care, United States of America
• Yaw Delali Bensah  University of Ghana, Ghana
• Yichen Shuai  National Institute of Standards and Technology, United States of America
• Yogesh E. Bhoge  Sudarshan Chemical Industries Ltd., India
• Yong-Cheng Lin  Central South University, China
• Yongxuan Liang  Applied Optoelectronics Inc., United States of America
• Yu Qiu  Fujian Jiangxia University, China
• Yun Wang  Georgia Institute of Technology, United States of America