The Quality Test of Wire Bonding

Caiyuan Wang, Ronglu Sun

Abstract


The reliability of the IC chip during performance of its function in any application is very much dependant on the quality of the wire bond interconnection. If the quality of the wire bond interconnection is poor and not consistent, it has a significant impact on the reliability and dependability of the device. The quality of a wire bond is determined by the strength of the interfaces between the bond wire and the bond pad as well as the bond wire and the lead finger. In this article, we discuss in detail established methodologies such as bond pull test, bond shear test, visual inspection and some special test of quality.


Full Text: PDF DOI: 10.5539/mas.v3n12p50

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Modern Applied Science   ISSN 1913-1844 (Print)   ISSN 1913-1852 (Online)

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