Technological Characterization and Use of Babassu Residue (Orbygnia phalerata Mart.) in Particleboard


  •  Nitalo André Machado    
  •  Hosana de Andrade    
  •  Luisa Parra-Serrano    
  •  Marileia Furtado    
  •  Raissa Rachel Silva-Matos    
  •  Maryzélia de Farias    
  •  Jomar Livramento Furtado    

Abstract

The wood-based panel industry is growing all over the world, and in many countries the raw material is becoming increasingly inadequate and increasingly expensive. Therefore, new inputs are needed to reduce production costs. The residue of babassu palm fruit after nut extraction process is an alternative, due to its fibrous characteristics, the high availability in the large agroindustrial complexes in the North of Brazil and the low cost. Thus the research was: (i) to determine the mechanical characteristics (tensile strength and elasticity), physicochemical characteristics (density, pH, extractives content and chemical composition) and micro-structural of the babassu residue, comparing it with the particles of Pinus sp., used in commercial panels; (ii) to evaluate the quality of panels manufactured with babassu residue by physical conditions (swelling in thickness and water absorption) and mechanical characterization (elasticity and rupture) based on Brazilian Technical Standards (NBR 14810-2: 2013), American (ANSI A208.1: 2009) and European (EN 312: 2003). Statistical analysis of the data was performed with the aid of Infostat software through analysis of variance using Tukey test at the 5% probability level. The babassu residue has technological characteristics that allow its use in particleboard production. However, there are particularities that may compromise its use, such as high silica content and high density.  Particleboard made from babassu residue presented mechanical performance above that required by current normative documents. However, for the physical properties, especially for the porosity of the particleboard of babassu, the obtained values were lower than the required minimum.



This work is licensed under a Creative Commons Attribution 4.0 License.