The Effect of DC Plating Parameters on the Composition and Morphology of Silver-copper Alloy

C. Shanthi, S. Barathan, Rajasrisen Jaiswal, R. M. Arunachalam

Abstract


This research attempts to optimize the parameters for DC plating of silver on silver alloy of two different
compositions namely 50% and 75% silver alloy. In the Silver –copper alloy, the surface morphology and composition
of the electro deposit are influenced by current density, silver concentration in the bath, applied current type and
addition of additive. It has been found that concentration of silver in silver alloy has an effect in weight electrodeposited over cathode in DC plating. The surface morphology is studied by taking SEM micrograph for the
two different compositions of silver alloy and grain size is measured using XRD analysis. Higher the purity of silver,
finer is the grain size. It has been observed that with the increase of silver in the sample, the amount of silver
deposited, hence the thickness of the deposit varies for the same current and voltage settings.

Full Text: PDF

Creative Commons License
This work is licensed under a Creative Commons Attribution 3.0 License.

Applied Physics Research   ISSN 1916-9639 (Print)   ISSN 1916-9647 (Online)

Copyright © Canadian Center of Science and Education

To make sure that you can receive messages from us, please add the 'ccsenet.org' domain to your e-mail 'safe list'. If you do not receive e-mail in your 'inbox', check your 'bulk mail' or 'junk mail' folders.

doaj_logo_new_120 images_120. proquest_logo_120 lockss_logo_2_120 udl_120.